Wafer-Scale Assembly of Highly Ordered Semiconductor Nanowire Arrays by Contact Printing

Fan, Zhiyong and Ho, Johnny C. and Jacobson, Zachery A. and Yerushalmi, Roie and Alley, Robert L. and Razavi, Haleh and Javey, Ali. (2008) Wafer-Scale Assembly of Highly Ordered Semiconductor Nanowire Arrays by Contact Printing. Nano Letters, 8 (1). pp. 20-25. ISSN 1530-6984

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Controlled and uniform assembly of “bottom-up” nanowire (NW) materials with high scalability presents one of the significant bottleneck challenges facing the integration of nanowires for electronic applications. Here, we demonstrate wafer-scale assembly of highly ordered, dense, and regular arrays of NWs with high uniformity and reproducibility through a simple contact printing process. The assembled NW pitch is shown to be readily modulated through the surface chemical treatment of the receiver substrate, with the highest density approaching 8 NW/μm, 95% directional alignment, and wafer-scale uniformity. Such fine control in the assembly is attained by applying a lubricant during the contact printing process which significantly minimizes the NW−NW mechanical interactions, therefore enabling well-controlled transfer of nanowires through surface chemical binding interactions. Furthermore, we demonstrate that our printing approach enables large-scale integration of NW arrays for various device structures on both rigid silicon and flexible plastic substrates, with a controlled semiconductor channel width ranging from a single NW (10 nm) up to 250 μm, consisting of a parallel array of over 1250 NWs and delivering over 1 mA of ON current.

Item Type: Article
InterNano Taxonomy: Nanoscale Objects and Nanostructured Materials > Nanowires
Nanomanufacturing Processes > Assembly Techniques
Collections: Nanomanufacturing Research Collection
Related URLs:
Depositing User: Rebecca Reznik-Zellen
Date Deposited: 28 Oct 2009 15:19
Last Modified: 28 Oct 2009 15:19
URI: http://eprints.internano.org/id/eprint/205

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