Collapse of stamps for soft lithography due to interfacial adhesion

Hsia, K. J. and Huang, Y. and Menard, E. and Park, J.-U. and Zhou, W. and Rogers, J. and Fulton, J. M.. (2005) Collapse of stamps for soft lithography due to interfacial adhesion. Applied Physics Letters, 86 (15). p. 154106. ISSN 00036951

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Item Type: Article
InterNano Taxonomy: Nanomanufacturing Processes
Nanomanufacturing Processes > Nanopatterning/Lithography
Collections: Nanomanufacturing Research Collection > Nanomanufacturing Nanoscale Science and Engineering Centers > Center for Nanoscale Chemical-Electrical-Mechanical Manufacturing Systems
Depositing User: Amulya Gullapalli
Date Deposited: 21 Jul 2011 17:19
Last Modified: 19 Sep 2011 17:08
URI: http://eprints.internano.org/id/eprint/1475

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