Hsia, K. J. and Huang, Y. and Menard, E. and Park, J.-U. and Zhou, W. and Rogers, J. and Fulton, J. M.. (2005) Collapse of stamps for soft lithography due to interfacial adhesion. Applied Physics Letters, 86 (15). p. 154106. ISSN 00036951
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Official URL: http://dx.doi.org/10.1063/1.1900303
Item Type: | Article |
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InterNano Taxonomy: | Nanomanufacturing Processes Nanomanufacturing Processes > Nanopatterning/Lithography |
Collections: | Nanomanufacturing Research Collection > Nanomanufacturing Nanoscale Science and Engineering Centers > Center for Nanoscale Chemical-Electrical-Mechanical Manufacturing Systems |
Depositing User: | Amulya Gullapalli |
Date Deposited: | 21 Jul 2011 17:19 |
Last Modified: | 19 Sep 2011 17:08 |
URI: | http://eprints.internano.org/id/eprint/1475 |
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