Hagberg, Erik C. and Scott, J. Campbell and Shaw, Justine A. and von Werne, Timothy A. and Maegerlein, Janet A. and Carter, Kenneth R.. (2007) Mold and Metallization: Nanocontact Molding for the Fabrication of Metal Structures. Small, 3 (10). pp. 1703-1706. ISSN 16136810
Full text not available from this repository. (Request a copy)Abstract
Plating up: A new fabrication technique for the creation of patterns of metal or circuitization on a substrate is demonstrated. Nanocontact molding allows for the reproduction of features ranging from millimeter to subnanometer features into a functional polymer layer (see image). Through the facile electroless plating of metallic copper directly from the surface of functional polymeric patterns, conductive metal features can be constructed at nanoscale dimensions.
Item Type: | Article |
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InterNano Taxonomy: | Nanoscale Objects and Nanostructured Materials > Nanocomposites > Thin films Nanomanufacturing Processes > Deposition of Nanostructured Films or Nanostructures > Electro-less deposition Nanomanufacturing Processes > Nanopatterning/Lithography |
Collections: | Nanomanufacturing Research Collection > Nanomanufacturing Nanoscale Science and Engineering Centers > Center for Hierarchical Manufacturing Nanomanufacturing Research Collection |
Depositing User: | Moureen Kemei |
Date Deposited: | 01 Feb 2010 19:55 |
Last Modified: | 19 Sep 2011 20:48 |
URI: | http://eprints.internano.org/id/eprint/250 |
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