Mold and Metallization: Nanocontact Molding for the Fabrication of Metal Structures

Hagberg, Erik C. and Scott, J. Campbell and Shaw, Justine A. and von Werne, Timothy A. and Maegerlein, Janet A. and Carter, Kenneth R.. (2007) Mold and Metallization: Nanocontact Molding for the Fabrication of Metal Structures. Small, 3 (10). pp. 1703-1706. ISSN 16136810

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Plating up: A new fabrication technique for the creation of patterns of metal or circuitization on a substrate is demonstrated. Nanocontact molding allows for the reproduction of features ranging from millimeter to subnanometer features into a functional polymer layer (see image). Through the facile electroless plating of metallic copper directly from the surface of functional polymeric patterns, conductive metal features can be constructed at nanoscale dimensions.

Item Type: Article
InterNano Taxonomy: Nanoscale Objects and Nanostructured Materials > Nanocomposites > Thin films
Nanomanufacturing Processes > Deposition of Nanostructured Films or Nanostructures > Electro-less deposition
Nanomanufacturing Processes > Nanopatterning/Lithography
Collections: Nanomanufacturing Research Collection > Nanomanufacturing Nanoscale Science and Engineering Centers > Center for Hierarchical Manufacturing
Nanomanufacturing Research Collection
Depositing User: Moureen Kemei
Date Deposited: 01 Feb 2010 19:55
Last Modified: 19 Sep 2011 20:48

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