Hagberg, Erik C. and Scott, J. Campbell and Shaw, Justine A. and von Werne, Timothy A. and Maegerlein, Janet A. and Carter, Kenneth R.. (2007) Mold and Metallization: Nanocontact Molding for the Fabrication of Metal Structures. Small, 3 (10). pp. 1703-1706. ISSN 16136810
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Official URL: http://dx.doi.org/10.1002/smll.200700343
Abstract
Plating up: A new fabrication technique for the creation of patterns of metal or circuitization on a substrate is demonstrated. Nanocontact molding allows for the reproduction of features ranging from millimeter to subnanometer features into a functional polymer layer (see image). Through the facile electroless plating of metallic copper directly from the surface of functional polymeric patterns, conductive metal features can be constructed at nanoscale dimensions.
| Item Type: | Article |
|---|---|
| InterNano Taxonomy: | Nanoscale Objects and Nanostructured Materials > Nanocomposites > Thin films Nanomanufacturing Processes > Deposition of Nanostructured Films or Nanostructures > Electro-less deposition Nanomanufacturing Processes > Nanopatterning/Lithography |
| Collections: | Nanomanufacturing Research Collection > Nanomanufacturing Nanoscale Science and Engineering Centers > Center for Hierarchical Manufacturing Nanomanufacturing Research Collection |
| ID Code: | 250 |
| Deposited By: | Moureen Kemei |
| Deposited On: | 01 Feb 2010 14:55 |
| Last Modified: | 19 Sep 2011 16:48 |
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