Atomic Layer Deposition for Nano-manufacturing

Deguns, Eric W. (2010) Atomic Layer Deposition for Nano-manufacturing. In: New England Nanomanufacturing Summit 2010, June 22 - 24, 2010, Lowell, MA. (Unpublished)

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Abstract

Atomic Layer Deposition (ALD) enables the fabrication of highly uniform and conformal thin films, and as such, has been adopted in a number of leading edge technologies. Due to the unique deposition process, ALD films can overcome challenges faced by traditional deposition techniques, such as conformaly depositing films less than 10nm, functionalizing difficult materials (such as plastics and graphene), and coating high-aspect ratio structures (such as DRAM trenches or porous materials). In this talk, an overview of the ALD reaction sequence, fundamentals and select applications developed by Cambridge NanoTech users will be presented. Examples of these applications include the use of ALD films for gate oxides and TCOs, as well as merging organic and inorganics for use in flexible electronics, OLEDs and biomaterials. The relative ease in scaling ALD processes from R&D to production will be discussed.

Item Type: Conference or Workshop Item (Paper)
Uncontrolled Keywords: ALD reaction sequence,
InterNano Taxonomy: Nanoscale Objects and Nanostructured Materials > Nanocomposites > Thin films
Nanomanufacturing Processes > Deposition of Nanostructured Films or Nanostructures > Atomic layer deposition (ALD)
Collections: National Nanomanufacturing Network Archive > Conferences and Workshops > New England Nanomanufacturing Summit 2010
Related URLs:
Depositing User: Rebecca Reznik-Zellen
Date Deposited: 02 Jul 2010 14:04
Last Modified: 02 Jul 2010 14:04
URI: http://eprints.internano.org/id/eprint/522

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