Hu, S. and Kim, T. H. and Park, J. G. and Busnaina, A. A.. (2010) Effect of Different Deposition Mediums on the Adhesion and Removal of Particles. Journal of The Electrochemical Society, 157 (6). H662. ISSN 00134651
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Official URL: http://dx.doi.org/10.1149/1.3377090
| Item Type: | Article |
|---|---|
| InterNano Taxonomy: | Nanoscale Objects and Nanostructured Materials |
| Collections: | Nanomanufacturing Research Collection > Nanomanufacturing Nanoscale Science and Engineering Centers > Center for High-rate Nanomanufacturing |
| Depositing User: | Amulya Gullapalli |
| Date Deposited: | 17 Jul 2011 19:40 |
| Last Modified: | 17 Jul 2011 19:40 |
| URI: | http://eprints.internano.org/id/eprint/975 |
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