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Hsia, K. J. and Huang, Y. and Menard, E. and Park, J.-U. and Zhou, W. and Rogers, J. and Fulton, J. M.. (2005) Collapse of stamps for soft lithography due to interfacial adhesion. Applied Physics Letters, 86 (15). p. 154106. ISSN 00036951

This list was generated on Wed Oct 28 07:53:48 2020 EDT.