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Hsia, K. J. and Huang, Y. and Menard, E. and Park, J.-U. and Zhou, W. and Rogers, J. and Fulton, J. M.. (2005) Collapse of stamps for soft lithography due to interfacial adhesion. Applied Physics Letters, 86 (15). p. 154106. ISSN 00036951

Huang, Yonggang Y. and Zhou, Weixing and Hsia, K. J. and Menard, Etienne and Park, Jang-Ung and Rogers, John A. and Alleyne, Andrew G.. (2005) Stamp Collapse in Soft Lithography. Langmuir, 21 (17). p. 8058. ISSN 0743-7463

This list was generated on Sat Oct 25 17:08:36 2014 EDT.