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Hsia, K. J. and Huang, Y. and Menard, E. and Park, J.-U. and Zhou, W. and Rogers, J. and Fulton, J. M.. (2005) Collapse of stamps for soft lithography due to interfacial adhesion. Applied Physics Letters, 86 (15). p. 154106. ISSN 00036951
Huang, Yonggang Y. and Zhou, Weixing and Hsia, K. J. and Menard, Etienne and Park, Jang-Ung and Rogers, John A. and Alleyne, Andrew G.. (2005) Stamp Collapse in Soft Lithography. Langmuir, 21 (17). p. 8058. ISSN 0743-7463
