Browse by Person
 | Up a level |
Number of items: 2.
Hsia, K. J. and Huang, Y. and Menard, E. and Park, J.-U. and Zhou, W. and Rogers, J. and Fulton, J. M.. (2005) Collapse of stamps for soft lithography due to interfacial adhesion. Applied Physics Letters, 86 (15). p. 154106. ISSN 00036951
Zhou, W. and Huang, Y. and Menard, E. and Aluru, N. R. and Rogers, J. A. and Alleyne, A. G.. (2005) Mechanism for stamp collapse in soft lithography. Applied Physics Letters, 87 (25). p. 251925. ISSN 00036951
